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Molex Woodhead TCDEI-8D0P-DYU-G02 Brad HarshIO 16-Input EtherNet/IP Module

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Molex Woodhead TCDEI-8D0P-DYU-G02 Brad HarshIO 16-Input EtherNet/IP Module

TCDEI-8D0P-DYU-G02
Condition:
New Original
In stock:
2
Weight
0.65kg
Demension
22.04x6x4cm
  • Product details
  • Specifications
  • Recommand
  • Service & Policy
ETHERNET/IP DIGITAL I/O · IP67
TYPE DESIGNATION
TCDEI-8D0P-DYU-G02
112095-5137
OFFICIAL PRODUCT NAME
HarshIO 16-Input EtherNet/IP Module
Direct-machine-mount 8-port M12 module with 16 PNP inputs and 7/8-inch power connection.
CONDITIONNew Original
WARRANTYOne year
AVAILABILITYIn stock
16 INPUTS · 8 M12 PORTS · IP67 · ETHERNET/IP
The Molex Woodhead TCDEI-8D0P-DYU-G02 Brad HarshIO module provides 16 PNP digital inputs over eight M12 ports with EtherNet/IP communication and IP67 direct-machine-mount protection.
TECHNICAL SPECIFICATIONS
Manufacturer Molex / Woodhead Engineering number TCDEI-8D0P-DYU-G02
Order number 112095-5137 Network EtherNet/IP
Digital inputs 16 PNP I/O ports 8 x M12, 5-pin
Ethernet ports 2 x M12 D-code Power connection 7/8-inch, 4-pole
I/O update Up to 1 ms Enclosure rating IP67
OPERATING ENVIRONMENT
 
Designed for direct machine mounting from -25°C to +70°C, with storage from -40°C to +90°C. The IP67 enclosure and industrial connectors support washdown-prone and harsh production areas.
-25 TO +70°C IP67 MOUNT HARSH DUTY
MONITORING & CONTROL
 
Use the embedded display and port indicators to check module, network and channel status. Verify addressing, EtherNet/IP link activity, input transitions and isolated power circuits during commissioning.
DISPLAY PORT STATUS I/O DIAGNOSTICS
BRAND & APPLICATION OVERVIEW
BRAND CHARACTERISTICS
 
Molex Woodhead Brad industrial I/O combines sealed connectors, direct-machine mounting and documented EtherNet/IP services for modular installation and rapid field diagnostics.
IP67 MOUNT DISPLAY DISTRIBUTED I/O
APPLICATION FIELDS
 
Used on assembly lines, packaging equipment, material handling and machine cells requiring distributed digital inputs close to sensors in harsh industrial environments.
ASSEMBLY LINES PACKAGING DISTRIBUTED I/O
RELATED MODELS
Molex Woodhead
TCDEI-8D0P-DYU-G02
TCDEI-888P-DYU-G02
TCDEI-8B4P-DYU-G02
TCDEI-80DP-DYU-G02
TCDEI-8YYX-DYU-G02
TCDEI-8YYX-D1U-G02
TCIEI-888P-DYU
TCIEP-888P-D1U
112095-5137
112095-5138
112095-5139
112095-5140
112095-5116
112095-5117
112095-5119
DRL-750M0G-D4U
SST-PB3-CLX-RLL
TCIEI-8B4P-DYU
TCIEI-80DP-DYU
TCIEP-8YYX-D1U
Koyo Electronics
D2-230
D2-240
D2-250-1
D2-260
D2-430
D2-440
D2-450
D2-16ND3-2
D2-16NA
D2-16TD1-2
D2-08NA-1
D2-04AD
D2-08AD-1
D2-02DA
D2-08TR
D4-450
D4-16ND2
D4-16TD2
F2-04AD-1
F2-08DA-1
ORDER & SERVICE FLOW
01 · IDENTIFY
Provide the complete TCDEI-8D0P-DYU-G02 and 112095-5137 markings, installed system, equipment position and required quantity.
02 · VERIFY
Confirm the full order code, revision, companion hardware, connections and compatibility with the documented installed architecture.
03 · QUOTE
Review condition, availability, warranty, lead time, protective packing and destination-based delivery terms.
04 · DISPATCH
Complete final identity checks, connector protection, shipment documentation and destination routing before release.
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